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深圳市丹邦科技股份有限公司 Shenzhen Danbond Technology Co.Ltd

  • Summary

    简介:成立于2001年,注册资本人民币36528万元,是专业从事挠性电路与材料的研发和生产的国家高新技术企业,是国家高技术研究发展计划成果产业化基地,拥有国家级挠性电路与材料研发中心,是中国最大的柔性材料到柔性封装基板到柔性芯片器件封装产品,是从设计、制造、服务一条龙产业链的服务供应商; 2016年营业收入:2.71亿元 Shenzhen Danbond Technology Co.Ltd (Danbond) is a listed company in Shenzhen Stock Exchange (002618). Danbond was established in 2001, with an investment of 180 million RMB. Danbond has been specializing in R&D and manufacturing of flexible circuit and its materials. To date, Danbond has developed a national R&D center for flexible circuit and its materials, and is the biggest supplier starting from design, manufacturing, to service of flexible materials, encapsulation for flexible circuit board, and its related products. Danbond has its own intellectual rights, including the core technology from manufacturing flexible material, encapsulating flexible circuit to encapsulating chip. Danbond provides the chain service from design, manufacturing, service and solutions for encapsulation. Our main products include flexible FCCL, high-intensity FPC, COF circuit for chips encapsulation, encapsulation products, as well as the encapsulation-related heat curing adhesive and micro adhesive glue film. Those products can be used in high-tech end products, such as in commercial electronics, medical device, special computer, digital display, high-tech equipping industry, national defense, military, and airspace industry.
  • Type

    top100,PCB,FPC, FPC-rigid,

  • Contact

    Tel:+86-755-26981518 Fax:+86-755-26511718 E-mail:szdbond@danbang.com

  • Website

    http://www.danbang.com/

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